Laserfiche WebLink
Metadata
Document management portal powered by Laserfiche WebLink 9 © 1998-2015 Laserfiche. All rights reserved.
INDIAN RIVER COUNTY JULY 25, 2014 <br />INTERGENERATIONAL RECREATION CENTER 100% CONSTRUCTION DOCUMENTS <br />PART 3 - EXECUTION <br />3.1 PREPARATION <br />A. General: Prepare and clean substrates according to resinous flooring manufacturer's written <br />instructions for substrate indicated. Provide clean, dry substrate for resinous flooring <br />application. <br />B. Concrete Substrates: Provide sound concrete surfaces free of laitance, glaze, efflorescence, <br />curing compounds, form -release agents, dust, dirt, grease, oil, and other contaminants <br />incompatible with resinous flooring. <br />1. Repair damaged and deteriorated concrete according to resinous flooring manufacturer's <br />written instructions. <br />2. Verify that concrete substrates are dry and moisture -vapor emissions are within <br />acceptable levels according to manufacturer's written instructions. <br />a. Perform anhydrous calcium chloride test, ASTM F 1869. Proceed with application <br />of resinous flooring only after substrates have maximum moisture -vapor -emission <br />rate of 3 Ib of water/1000 sq. ft. (1.36 kg of water/92.9 sq. m) of slab area in 24 <br />hours or as per manufacturer's requirements. <br />b. Perform plastic sheet test, ASTM D 4263. Proceed with application only after <br />testing indicates absence of moisture in substrates. <br />c. Perform relative humidity test using in situ probes, ASTM F 2170. Proceed with <br />installation only after substrates have a maximum 75 percent relative humidity <br />level measurement or as per manufacturer's requirements. <br />3. Alkalinity and Adhesion Testing: Verify that concrete substrates have pH within <br />acceptable range. Perform tests recommended by manufacturer. Proceed with application <br />only after substrates pass testing. <br />C. Resinous Materials: Mix components and prepare materials according to resinous flooring <br />manufacturer's written instructions. <br />D. Use patching and fill material to fill holes and depressions in substrates according to <br />manufacturer's written instructions. <br />E. Treat control joints and other nonmoving substrate cracks to prevent cracks from reflecting <br />through resinous flooring according to manufacturer's written instructions. <br />3.2 APPLICATION <br />A. General: Apply components of resinous flooring system according to manufacturer's written <br />instructions to produce a uniform, monolithic wearing surface of thickness indicated. <br />1. Coordinate application of components to provide optimum adhesion of resinous flooring <br />system to substrate, and optimum intercoat adhesion. <br />2. Cure resinous flooring components according to manufacturer's written instructions. <br />Prevent contamination during application and curing processes. <br />RESINOUS FLOORING 09 67 23 - 4 <br />